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[Recruitment Overview]
Job Category: Electrical/Electronic Components and Products Assembler (836000)
Number of Openings: 3
Employment Type: Permanent employment contract / No preference for dispatched workers / No preference for hiring replacement workers
Experience: Not required
Education: No educational requirements
Wage: Hourly wage 10,320 KRW or higher
Application Deadline: Until filled
[Job Description]
■ [2026 Second Half Gunpo City Job Fair] On-site Participating Company
* Recruitment Process: ▶ Check job posting ▶ Bring resume and ID ▶ On-site interview
* Date & Time: October 21, 2026 (Wed) 14:00–16:00
* Interview Location: Gunpo City Hall Main Building, 2nd Floor (Conference Room)
※ The parking lot will be crowded on the day of the event, so please use public transportation. (Parking fee support not available)
▶ Job Description
① Responsibilities: Semiconductor substrate cleaning, inspection, and packaging
② Working Hours: 5 days a week, 8:30 AM – 5:30 PM
③ Qualifications: None required
④ Salary: Hourly wage of 10,320 KRW or more
⑤ Workplace: 65, Gunpo Cheomdansap 2-ro, Gunpo-si
[Working Hours]
Weekdays: (Morning) 8:30 AM – (Afternoon) 5:30 PM, 5 days a week
[Work Location]
(15880) 65, Gunpo Cheomdansap 2-ro, Gunpo-si, Gyeonggi-do (Bugok-dong)
Nearest Subway Station: Line 1, Uiwang Station Exit 4, 1 KM
[Benefits]
National Pension, Employment Insurance, Industrial Accident Insurance, Health Insurance / Retirement Pension
[Selection/Application]
Selection Method: Document screening, Interview
Application Method: Other (Job Fair) On-site Interview)
Required Documents: Resume, Cover Letter
[Company]
Industry: Other Semiconductor Device Manufacturing
Main Business: Wafer Manufacturing
Number of Employees: 28
Company Size: Small and Medium-sized Enterprise (SME)
Source: Employment 24 (Korea Employment Information Service)